There are a variety of available packaging options. Each has its strengths and weaknesses. TAB or COF modules can be designed in any shape. Additional components can be placed on-board to minimize system cost.
COF (Chip-on-Film/Foil)
This package consists of an LCD panel mated to a piece of film or foil that has the driver mounted to it.
It has the following attributes and benefits:
Single chip solution for driver and controller
Directly mount LSI and other components on FPC
More cost effective than TAB
Thin and flexible
TCP(Tape Carrier Package)
This package consists of an LCD panel mated to a TCP (TAB) and an ACF. Glass can be designed to any specification with any number of pixels or icons. Choose from a wide variety of display modes and polarizer options in standard or wide temperature.
TAB modules have the following attributes and benefits:
Applicable pitch: 70 ~ 300 µm
Compact
TAB process
Suitable for high duty application
High assembly efficiency
External PCB for other components
COB ( Chip-on-Board)
This technology has been around along time and is the direct successor to the very ancient Quad Flat Package technology. A COB module consists of the LCD panel, Bezel, Elastomeric Zebra Strips, and PCB with SMT (COB).
It has the following attributes and benefits:
Pitch has to be greater than 400 µm
Traditional assembly technology
Highly rework able
COG (Chip-on-Glass)
Based on a special proprietary process technology optimized for quality performance and high contrast, the AMP Display COG modules are the latest LCD technology. With an overall thickness of less than 2.0 mm, Chip-On-Glass incorporates slim-chip LCD driver circuits onto the surface of the glass. Designed primarily for the telecommunication, PDA, and GPS markets, Chip-on-Glass offers numerous reliability benefits besides its mechanical thinness.
